Press Releases 2023

Notice Regarding Determination of
Annual Dividend Rate of
Series 1 Bond-Type Class Shares

October 13, 2023
SoftBank Corp.

SoftBank Corp. (the “Company”) hereby announces that the Board of Directors today determined the annual dividend rate for the Preferred Dividend to the Series 1 Bond-Type Class Shares, which are to be issued pursuant to the resolution of the Board of Directors on September 25, 2023 (the “Offering”).

1. Annual Dividend Rate	(ⅰ) If the record date falls in a fiscal year ending on or before March 31, 2029: 2.500% per annum^* (ⅱ) If the record date falls in a fiscal year ending on or after April 1, 2029: The interest rate of One-Year Japanese government bonds (JGBs) as of the date two business days before the last day of the fiscal year before the fiscal year in which the record date falls plus 3.182% [Note] * The amount of the Preferred Dividend to Series 1 Bond-Type Class Shares with a record date of March 31, 2024 will be 41.53 yen (calculated based on actual day counts on a 366-day year basis).
2. Subscription Period	Monday, October 16, 2023 to Tuesday, October 31, 2023

1. Annual Dividend Rate

(ⅰ)
If the record date falls in a fiscal year ending on or before March 31, 2029:
2.500% per annum^*
(ⅱ)
If the record date falls in a fiscal year ending on or after April 1, 2029:
The interest rate of One-Year Japanese government bonds (JGBs) as of the date two business days before the last day of the fiscal year before the fiscal year in which the record date falls plus 3.182%

[Note]

*
The amount of the Preferred Dividend to Series 1 Bond-Type Class Shares with a record date of March 31, 2024 will be 41.53 yen (calculated based on actual day counts on a 366-day year basis).

2. Subscription Period

Monday, October 16, 2023 to Tuesday, October 31, 2023

(Reference)

Ⅰ. Outline of Issuance of Series 1 Bond-Type Class Shares besides the Above

1. Class and Number of Shares for Subscription	Series 1 Bond-Type Class Shares of SoftBank Corp.: 30,000,000 shares
2. Issue Price (Offer Price)	4,000 yen per share
3. Amount to be Paid in	4,000 yen per share
4. Amount of Increase in Common Stock and Additional Paid-in Capital	Amount of increase in common stock 60 billion yen (2,000 yen per share) Amount of increase in additional paid-in capital 60 billion yen (2,000 yen per share) [Note] * The Company has passed a resolution on September 25, 2023 to reduce its common stock and additional paid-in capital, in each case as shown on its statement of financial position, by the amount of the increase in common stock and additional paid-in capital as a result of the issuance of the Series 1 Bond-Type Class Shares through the Offering, as of the Payment Date, subject to that payment taking place, and to transfer the full amount of both to “other capital surplus.”
5. Payment Date	Wednesday, November 1, 2023
6. Listing (Trading Commencement) Date	Thursday, November 2, 2023

Ⅱ. Use of Proceeds

The Company intends to use the approximate net proceeds of 116,400,000,000 yen to finance growth investments that will contribute to the medium- to long-term enhancement of corporate value, such as the realization of services using generative AI (artificial intelligence capable of generating a variety of content, including text, images, and program code), the construction of next-generation social infrastructure, and the development and procurement of renewable energy, as well as capital expenditures for base stations, network facilities, etc. Specifically, 20,000,000,000 yen will be used in FY2023 to fund capital expenditures related to the construction of the computing infrastructure required for a future coexistence with AI (artificial intelligence), and the remaining amount will be used by March 31, 2025 to finance growth investments other than the capital expenditures above or capital expenditures for base stations, network facilities, etc., respectively.

Note: This press release is intended to announce certain information regarding the issuance of the Series 1 Bond-Type Class Shares and has not been prepared for the purpose of soliciting investments or other conduct of similar nature whether in Japan, the United States, or elsewhere. This press release does not constitute an offer to sell, or a solicitation of an offer to buy, securities in the United States. The securities referred to in this press release have not been, and will not be, registered under the United States Securities Act of 1933, as amended (hereinafter the “Securities Act”). The securities may not be offered or sold in the United States absent registration or an exemption from registration under the Securities Act. The securities referred to above will not be publicly offered or sold in the United States.

SoftBank, the SoftBank name and logo are registered trademarks or trademarks of SoftBank Group Corp. in Japan and other countries.
Other company, product and service names in this press release are registered trademarks or trademarks of the respective companies.